Analysis of Electro-Thermal Coupling Topology Optimization Based on Two-Dimensional Density Method

XU Yanyan, XIE Bin, CHEN Mingxiang

MICROPROCESSORS ›› 2024, Vol. 45 ›› Issue (6) : 31-36.

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MICROPROCESSORS ›› 2024, Vol. 45 ›› Issue (6) : 31-36. DOI: 10.3969/j.issn.1002-2279.2024.06.005
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Analysis of Electro-Thermal Coupling Topology Optimization Based on Two-Dimensional Density Method

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 45(6): 31-36 https://doi.org/10.3969/j.issn.1002-2279.2024.06.005

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