Simulation Analysis of Thermal Deformation in Plastic-Encapsulated BGA Based on Abaqus

LI Jinyong, PENG Zhenfei, ZHU Zhongqi, ZHAO Yang

MICROPROCESSORS ›› 2024, Vol. 45 ›› Issue (5) : 57-60.

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MICROPROCESSORS ›› 2024, Vol. 45 ›› Issue (5) : 57-60. DOI: 10.3969/j.issn.1002-2279.2024.05.014
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Simulation Analysis of Thermal Deformation in Plastic-Encapsulated BGA Based on Abaqus

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 45(5): 57-60 https://doi.org/10.3969/j.issn.1002-2279.2024.05.014

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