基于三维层叠封装技术的过流保护器设计

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张可, 林雨佳, 刘洪涛

Design of over-current protector based on three-dimensional stacked packaging technology

ZHANG Ke, LIN Yujia, LIU Hongtao

微处理机 . 2025, (6): 55 -60 . DOI: 10.3969/j.issn.1002-2279.2025.06.011